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Semiconductor Dedicated of Hydrostatic Wafer Grinder
Model number:GTR-1215
Characteristics
- Won the 2023 Taiwan Excellence Award.
- Online Monitor of Grinding status, prevent the wafer from being deformed and damaged.
- Real-time monitoring of wafer thickness and automatic correction to ensure the accuracy of wafer thickness.
- Chuck table could be customized according to the needs of different sizes wafers.
- Achieve 300mm Si wafer thinning thickness <100µm, TTV <2µm, Ra 0.01µm
- Especially designed for widely used in high hardness plane materials, rapid thinning, and achieve the effect of flattening.
- Optional granite base.
Specification
Model | Unit | GTR-1215 |
Wheel Spindle | ||
Spindle Type | Hydrostatic | |
Spindle Accuracy (run-out) | mm | <0.001 |
Max. Wheel Spindle Speed | rpm | 0~3000 |
Grinding Wheel Size (Diameter) | mm | Ø304 |
Rotary Table | ||
Table Type | Hydrostatic | |
Rotary Table Accuracy (run-out) | mm | 0.001 |
Speed of Rotary Table | rpm | 5~300 |
Max. Table Load | kg | 500 |
Vacuum Chuck Diameter | mm | 4"~12" |
Rotary Table Diameter | mm | 12" |
Auto Dressing System | ||
Dressing Wheel Diameter | mm | Ø150xØ90x20T |
Min. Feed-rate | sec. | 0.1μm |
Other | ||
Net/Gross Weight | kg | 2800/3200 |
Machine Size (LxWxH) | mm | 1872x1215x2380 |